Job DescriptionOur vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.Our Opportunity Summary:For more than 43 years, Micron Technology, Inc. has redefined innovation with the world’s most advanced memory and semiconductor technologies. We’re an international team of visionaries and scientists, developing groundbreaking technologies that are transforming how the world uses information to enrich life.As a MTS | DMTS HBM SOC Design Engineer, you will be responsible for the design & development of next-generation HBM DRAM products. You will be part of a highly multi-functional team of technical domain experts collaborating closely with a distributed team of Design Engineering, Product Engineering, Process Development, Package Engineering & Business Units to implement a common goal of ensuring our future HBM roadmap is successful. You will apply your deep understanding of SOC Architecture, RTL Logic Design, IP Integration, high-speed interface design, high-performance computing architectures, and 2.5D & 3D package integration to understand and analyze bottlenecks and propose innovative architectures to target best-in-class performance, power, cost, reliability and quality for Micron’s HBM product portfolio.In HBM HIG (High Bandwidth Memory – Heterogeneous Integration Group), we innovate and integrate end-to-end groundbreaking front-end and backend processes with groundbreaking design, simulation, testing, debugging, and qualification techniques to develop the lowest power per bit solutions to improve customer experience in the field of ML (Machine Learning) and AI (Artificial Intelligence). The success of a sophisticated product such as HBM relies vastly on vertical integration and the various engineering working in unison. To provide greater detail, our HBM technology pertains to stacking numbers of DRAM chips along with a logic chip within one package through an assembly technology called TSV (Through Silicon Via). This greatly increases the memory density in a package, while allowing very high-speed signal transmission. Furthermore, "high bandwidth"; is an outstanding memory design area where custom gate-level design and RTL style logic design are blended into the same product, and most of the DDR or LPDDR design is based on the gate-level design only while the Logic chip can use a full ASIC flow. Lastly, verification and testing (validation) of HBM is the most challenging due to the total size of the design and complexity of the functions, and in addition to craft, many innovations are needed for verification and validation of the HBM product, thereby making it uniquely exciting.Our team vision is a continuing desire to develop your skills working in an inclusive diverse environment of multicultural Teams across worldwide geographies! Enabling the creative career path you deserve with a collaborative environment and groundbreaking technology and growing upon your imagination and creativity.What’s Encouraged Daily:Analyze customer requirements and specification documents, work with IP vendors to select off-the-shelf IPs, and modify or custom design new ones if needed.Review architectural specifications and provide constructive feedback to help create high-quality specifications.Efficiently and productively execute project deliverables, whether writing specifications, developing RTL, integrating IP, testing code, debugging failures, running static checks and resolving issues identified by static checks.Proactively identify and flag quality issues, performance problems, and opportunities to reduce power consumption in architecture, microarchitecture, RTL, or circuits.Collaborate with the verification team by reviewing test plans, assisting with writing assertions and coverage monitors, and providing feedback and suggestions for test changes.Debug and identify root causes and solutions for pre-silicon and post-silicon issues encountered in current HBM products and architectures.Engage with customers to support issues with current HBM architectures and find opportunities to innovate on future HBM solutions.How To Qualify:10+ years of relevant job/skill-related experience.Proficiency in microarchitecture and high-quality RTL development with the ability to write and test code in System Verilog.Experience dealing with clock domain crossings (CDC).Experience with SOC interconnects and bus standards like AMBA AXI, ACE, APB, AHB, etc.Ability to write assertions using SVA.Understanding of how to optimize a design for performance and low power consumption and how to use UPF.Good knowledge of static timing analysis, synthesis design constraints, and how to close timing by using logic techniques, false path constraints, and multi-cycle path constraints.Understanding of design for testability concepts such as MBIST and scan and how to write RTL for testability.Proven track record of innovation and problem-solving in high-performance and/or low power SOC development.Experience delivering highly technical solutions.What Sets You Apart:BSEE or higher.Proven track record of innovation and problem-solving in high-performance and/or low power SOC development.Familiarity with DRAM operation and JEDEC specifications, preferably with the HBM product family.Familiarity with scripting languages such as Python.Experience with working on one or more of the following IPs: UCIE, Memory Controller, NOCs.Experience with NOC generation tools.Experience in any of the following focus areas: memory array architectures, on-die and off-die high-speed signaling, PHY & interface development, power delivery network planning and optimization, power consumption reduction, CMOS requirements identification, packaging technologies, and thermal modeling.Good verbal and written communication skills with the ability to efficiently synthesize and convey sophisticated technical concepts to other partners and leadership.A self-motivated, hard-working team player who enjoys working with diverse abilities and backgrounds.An innovative approach that is open to improving upon any of our processes or products.Potential Team Member Locations: Folsom, CAAtlanta, GAAllen, TX(Disclaimer): While you may not exhibit all of the characteristics/skills listed above today, we are highly interested in a teammate who is motivated to grow in technical breadth and depth. Suppose you are open to learning while being a valued member of a team of premier engineers. In that case, we are determined to help build upon your existing foundation, while rapidly growing your individual and collaborative skills in this exciting and outstanding opportunity.The US base salary range that Micron Technology estimates it could pay for this full-time position is:$158,000.00 - $367,000.00Our salary ranges are determined by role, level, and location. The range displayed on each job posting reflects the minimum and maximum target for new hire salaries of the position across all US locations. Within the range, individual pay is determined by work location and additional job-related factors, including knowledge, skills, experience, tenure and relevant education or training. The pay scale is subject to change depending on business needs. Your recruiter can share more about the specific salary range for your preferred location during the hiring process. Additional compensation may include benefits, discretionary bonuses and equity. As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.To learn about your right to work click here.To learn more about Micron, please visit micron.com/careersUS Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s People Organization at hrsupport_na@micron.com or 1-800-336-8918 (select option #3)Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.
Job DescriptionOur vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.Our Opportunity Summary:For more than 43 years, Micron Technology, Inc. has redefined innovation with the world’s most advanced memory and semiconductor technologies. We’re an international team of visionaries and scientists, developing groundbreaking technologies that are transforming how the world uses information to enrich life.As an HBM SOC Design Engineer, you will be responsible for the design & development of next-generation HBM DRAM products. You will be part of a highly multi-functional team of technical domain experts collaborating closely with a distributed team of Design Engineering, Product Engineering, Process Development, Package Engineering & Business Units to implement a common goal of ensuring our future HBM roadmap is successful. You will apply your deep understanding of SOC Architecture, RTL Logic Design, IP Integration, high-speed interface design, high-performance computing architectures, and 2.5D & 3D package integration to understand and analyze bottlenecks and propose innovative architectures to target best-in-class performance, power, cost, reliability and quality for Micron’s HBM product portfolio.In HBM HIG (High Bandwidth Memory – Heterogeneous Integration Group), we innovate and integrate end-to-end groundbreaking front-end and backend processes with groundbreaking design, simulation, testing, debugging, and qualification techniques to develop the lowest power per bit solutions to improve customer experience in the field of ML (Machine Learning) and AI (Artificial Intelligence). The success of a sophisticated product such as HBM relies vastly on vertical integration and the various engineering working in unison. To provide greater detail, our HBM technology pertains to stacking numbers of DRAM chips along with a logic chip within one package through an assembly technology called TSV (Through Silicon Via). This greatly increases the memory density in a package, while allowing very high-speed signal transmission. Furthermore, "high bandwidth"; is an outstanding memory design area where custom gate-level design and RTL style logic design are blended into the same product, and most of the DDR or LPDDR design is based on the gate-level design only while the Logic chip can use a full ASIC flow. Lastly, verification and testing (validation) of HBM is the most challenging due to the total size of the design and complexity of the functions, and in addition to craft, many innovations are needed for verification and validation of the HBM product, thereby making it uniquely exciting.Our team vision is a continuing desire to develop your skills working in an inclusive diverse environment of multicultural Teams across worldwide geographies! Enabling the creative career path you deserve with a collaborative environment and groundbreaking technology and growing upon your imagination and creativity.What’s Encouraged Daily:Analyze customer requirements and specification documents, work with IP vendors to select off-the-shelf IPs, and modify or custom design new ones if needed.Review architectural specifications and provide constructive feedback to help create high-quality specifications.Efficiently and productively execute project deliverables, whether writing specifications, developing RTL, integrating IP, testing code, debugging failures, running static checks and resolving issues identified by static checks.Proactively identify and flag quality issues, performance problems, and opportunities to reduce power consumption in architecture, microarchitecture, RTL, or circuits.Collaborate with the verification team by reviewing test plans, assisting with writing assertions and coverage monitors, and providing feedback and suggestions for test changes.Debug and identify root causes and solutions for pre-silicon and post-silicon issues encountered in current HBM products and architectures.Engage with customers to support issues with current HBM architectures and find opportunities to innovate on future HBM solutions.How To Qualify:3+ years of relevant job/skill-related experience.Proficiency in microarchitecture and high-quality RTL development with the ability to write and test code in System Verilog.Experience dealing with clock domain crossings (CDC).Experience with SOC interconnects and bus standards like AMBA AXI, ACE, APB, AHB, etc.Ability to write assertions using SVA.Understanding of how to optimize a design for performance and low power consumption and how to use UPF.Good knowledge of static timing analysis, synthesis design constraints, and how to close timing by using logic techniques, false path constraints, and multi-cycle path constraints.Understanding of design for testability concepts such as MBIST and scan and how to write RTL for testability.Proven track record of innovation and problem-solving in high-performance and/or low power SOC development.Experience delivering highly technical solutions.What Sets You Apart:BSEE or higher.Proven track record of innovation and problem-solving in high-performance and/or low power SOC development.Familiarity with DRAM operation and JEDEC specifications, preferably with the HBM product family.Familiarity with scripting languages such as Python.Experience with working on one or more of the following IPs: UCIE, Memory Controller, NOCs.Experience with NOC generation tools.Experience in any of the following focus areas: memory array architectures, on-die and off-die high-speed signaling, PHY & interface development, power delivery network planning and optimization, power consumption reduction, CMOS requirements identification, packaging technologies, and thermal modeling.Good verbal and written communication skills with the ability to efficiently synthesize and convey sophisticated technical concepts to other partners and leadership.A self-motivated, hard-working team player who enjoys working with diverse abilities and backgrounds.An innovative approach that is open to improving upon any of our processes or products.Potential Team Member Locations: Folsom, CAAtlanta, GAAllen, TX(Disclaimer): While you may not exhibit all of the characteristics/skills listed above today, we are highly interested in a teammate who is motivated to grow in technical breadth and depth. Suppose you are open to learning while being a valued member of a team of premier engineers. In that case, we are determined to help build upon your existing foundation, while rapidly growing your individual and collaborative skills in this exciting and outstanding opportunity.The US base salary range that Micron Technology estimates it could pay for this full-time position is:$105,500.00 - $280,000.00Our salary ranges are determined by role, level, and location. The range displayed on each job posting reflects the minimum and maximum target for new hire salaries of the position across all US locations. Within the range, individual pay is determined by work location and additional job-related factors, including knowledge, skills, experience, tenure and relevant education or training. The pay scale is subject to change depending on business needs. Your recruiter can share more about the specific salary range for your preferred location during the hiring process. Additional compensation may include benefits, discretionary bonuses and equity. As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.To learn about your right to work click here.To learn more about Micron, please visit micron.com/careersUS Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s People Organization at hrsupport_na@micron.com or 1-800-336-8918 (select option #3)Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.
Job DescriptionOur vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.Our Opportunity Summary:For more than 43 years, Micron Technology, Inc. has redefined innovation with the world’s most advanced memory and semiconductor technologies. We’re an international team of visionaries and scientists, developing groundbreaking technologies that are transforming how the world uses information to enrich life.As an HBM SOC Pre-Silicon Verification Engineer, you will be responsible for the design & development of next-generation HBM DRAM products. You will be part of a highly multi-functional team of technical domain experts collaborating closely with a distributed team of Design Engineering, Product Engineering, Process Development, Package Engineering & Business Units to implement a common goal of ensuring our future HBM roadmap is successful. You will apply your deep understanding of SOC Architecture, RTL Logic Design, IP Integration, high-speed interface design, high-performance computing architectures, and 2.5D & 3D package integration to understand and analyze bottlenecks and propose innovative architectures to target best-in-class performance, power, cost, reliability and quality for Micron’s HBM product portfolio.In HBM HIG (High Bandwidth Memory – Heterogenous Integration Group), we innovate and integrate end-to-end groundbreaking front-end and backend processes with groundbreaking design, simulation, testing, debugging and qualification techniques to develop the lowest power per bit solutions to improve customer experience in the field of ML (Machine Learning) and AI (Artificial Intelligence). The success of a sophisticated product such as HBM relies vastly on vertical integration and the various engineering working in unison. To provide greater detail, our HBM technology pertains to stacking numbers of DRAM chips along with a logic chip within one package through an assembly technology called TSV (Through Silicon Via). This greatly increases the memory density in a package, while allowing very high-speed signal transmission. Furthermore, "high bandwidth"; is an outstanding memory design area where custom gate-level design and RTL style logic design are blended into the same product, and most of the DDR or LPDDR design is based on the gate-level design only while the Logic chip can use a full ASIC flow. Lastly, verification and testing (validation) of HBM is the most challenging due to the total size of the design and complexity of the functions, and in addition to craft, many innovations are needed for verification and validation of the HBM product, thereby making it uniquely exciting.What’s Encouraged Daily:Develop test plans at IP/Subsystem/SOC Level.Review architectural specifications to ensure high quality.Be efficient and productive in executing project deliverables, whether developing verification environments, creating test plans, writing and running tests, debugging failures, coding assertions and cover points, and modifying tests to hit target coverage.Work with IP suppliers to ensure that proper validation collateral is provided.Work with customers to understand their validation requirements and provide validation collateral as needed.Be proactive in identifying and flagging quality issues, performance problems, and opportunities to reduce power consumption.Debug and identify root causes and solutions for pre-silicon and post-silicon issues encountered in current HBM products and architectures.Engage with customers to support issues with current HBM architectures and find opportunities to innovate on future HBM solutions.How To Qualify:Ability to develop validation environments using System Verilog and UVM.Ability to write tests using UVM.Experience with writing assertions and coverage monitors using SVA.Knowledge of Register Description Languages such as SystemRDL and UVM RAL.Solid understanding of computer architecture concepts.Experience with SOC interconnects and bus standards like AMBA AXI, ACE, APB, AHB, etc.Experience with scripting languages such as Python.+ years of relevant job/skill-related experience.Experience delivering highly technical solutions.What Sets You Apart:BSEE or greater.Proven track record of innovation and problem-solving in building verification environments and/or validating complex SOCs.Experience working with Synopsys and/or Cadence validation IPs.Familiarity with DRAM operation and JEDEC specifications, preferably with the HBM product family.Experience working on gate-level simulation (GLS).Experience with coding in C++.Experience with modeling using SystemC.Experience writing and debugging tests to quantify and improve system performance and/or reduce power consumption.Experience in any of the following IPs: UCIE, memory controller, NOCs, MBIST, ATPG scan controllers.Good verbal and written communication skills with the ability to efficiently synthesize and convey sophisticated technical concepts to other partners and leadership.A self-motivated, hard-working team player who enjoys working with diverse abilities and backgrounds.Having an innovative approach that is open to improving upon any of our processes or products.As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.To learn about your right to work click here.To learn more about Micron, please visit micron.com/careersFor US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s People Organization at hrsupport_na@micron.com or 1-800-336-8918 (select option #3)Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.
Job DescriptionOur vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.Job DescriptionMicron is THE place for someone to expand their career by working on key projects and developing themself into the leaders of tomorrow! We provide online learning opportunities and on-the-job training to upgrade your skills. We have a dedicated Micron University for your online learning!We focus on empowering our customers’ latest and the greatest innovations across a wide spectrum of industries and applications—so your work as a Micron team member can have a broad impact. And thanks to our welcoming yet fast-paced work environment, it is easy to collaborate with fellow team members to get difficult problems solved and turn customers’ dreams into reality faster.The Senior/Principal HBM CAD Engineer is a technical leadership role within the Engineering Automation (EA) organization at Micron. We deliver DTK (Design Technology Kit) collateral, environments, tools and flows for the design, implementation, verification, & tape out of custom memory designs. These CAD tools and collateral enable DRAM, NAND, and other emerging memory designs on a range of industry-leading Micron-developed process nodes.Specific focus:TSMC mixed-signal, custom-digital experience like ADE-XL, Spectre, synthesis tools (DC/Genus), implementation tools (ICC2, Innovus), STA (Primetime, Tempus), EMIR (Redhawk, Voltus etc), functional & timing verification of cell-based designs (dynamic simulation and static analysis). Our ideal candidates combine pure digital RTL2GDS blocks with custom digital & analog blocks using TSMC collateral/environments for high speed, low power, area-efficient designs.Responsibilities:Own the day-to-day support of CAD tools, flows and collateral provided by functionally organized CAD teams worldwide to HBM design teams at the Dallas or Folsom Design Center. The tools and flows enable all aspects of mixed-signal, transistor-level custom IC design including logical design, custom layout, parameterized cells, automated place and route tools, physical design verification (LVS, DRC), ERC, Layout Parasitic Extraction, pre and post layout net listing and simulation, digital and analog circuit simulation, timing and power analysis, reliability simulation and analysis (including HCI, BTI, EM/IR), tape out and mask generation.Drive close collaboration with HBM design, layout, & verification methodology teams to propose and co-develop capabilities outstanding or under supported by EDA vendors and deploy outstanding practices and methodologies consistently to High Bandwidth Memory designs worldwide.Drive research and development at the intersection of IC Design Automation and Machine Learning to envision, scope, develop and deliver solutions benefiting IC design.Qualifications:Bachelor or preferably Masters/PhD in Computer Engineering, Computer Science or Electrical Engineering(5-15) + years of direct CAD or Design experience in Digital RTL to GDS Flows.Familiarity with memory design preferred (DDR3/4/5, LP3/4/5, HBM, NAND)Knowledge of CMOS circuit design, layout and verificationKnowledge and experience vetting and deploying sophisticated EDA software flowsExperience qualifying vendor tools and internally developed software releasesExperience developing software prototypes for innovative ideas in IC design, layout, and analysisExperience running agile (software) sprints is a plusExperience with Machine Learning algorithms and applicationsExcellent communication and problem-solving skills are requiredStrive to continuously learn, develop new skills, and self-improveThe US base salary range that Micron Technology estimates it could pay for this full-time position is:$100,000.00 - $253,500.00Our salary ranges are determined by role, level, and location. The range displayed on each job posting reflects the minimum and maximum target for new hire salaries of the position across all US locations. Within the range, individual pay is determined by work location and additional job-related factors, including knowledge, skills, experience, tenure and relevant education or training. The pay scale is subject to change depending on business needs. Your recruiter can share more about the specific salary range for your preferred location during the hiring process. Additional compensation may include benefits, discretionary bonuses and equity. As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.To learn about your right to work click here.To learn more about Micron, please visit micron.com/careersUS Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s People Organization at hrsupport_na@micron.com or 1-800-336-8918 (select option #3)Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.
Job DescriptionOur vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.Our Opportunity Summary:For more than 43 years, Micron Technology, Inc. has redefined innovation with the world’s most advanced memory and semiconductor technologies. We’re an international team of visionaries and scientists, developing groundbreaking technologies that are transforming how the world uses information to enrich life.As an HBM SOC Design and Integration Engineer, you will be responsible for the design & development of next-generation HBM DRAM products. You will be part of a highly multi-functional team of technical domain experts collaborating closely with a distributed team of Design Engineering, Product Engineering, Process Development, Package Engineering & Business Units to implement a common goal of ensuring our future HBM roadmap is successful. You will apply your deep understanding of SOC Architecture, RTL Logic Design, IP Integration, high-speed interface design, high-performance computing architectures, and 2.5D & 3D package integration to understand and analyze bottlenecks and propose innovative architectures to target best-in-class performance, power, cost, reliability and quality for Micron’s HBM product portfolio.In HBM HIG (High Bandwidth Memory – Heterogenous Integration Group), we innovate and integrate end-to-end groundbreaking front-end and backend processes with groundbreaking design, simulation, testing, debugging and qualification techniques to develop the lowest power per bit solutions to improve customer experience in the field of ML (Machine Learning) and AI (Artificial Intelligence). The success of a sophisticated product such as HBM relies vastly on vertical integration and the various engineering working in unison. To provide greater detail, our HBM technology pertains to stacking numbers of DRAM chips along with a logic chip within one package through an assembly technology called TSV (Through Silicon Via). This greatly increases the memory density in a package, while allowing very high-speed signal transmission. Furthermore, "high bandwidth"; is an outstanding memory design area where custom gate-level design and RTL style logic design are blended into the same product, and most of the DDR or LPDDR design is based on the gate-level design only while the Logic chip can use a full ASIC flow. Lastly, verification and testing (validation) of HBM is the most challenging due to the total size of the design and complexity of the functions, and in addition to craft, many innovations are needed for verification and validation of the HBM product, thereby making it uniquely exciting.What’s Encouraged Daily:Analyze customer requirements and specification documents, work with IP vendors to select off-the-shelf IPs, and modify or custom design new ones if needed.Review architectural specifications and provide constructive feedback to help create high-quality specifications.Efficiently and productively execute project deliverables, whether writing specifications, developing RTL, integrating IP, testing code, debugging failures, running static checks and resolving issues identified by static checks.Proactively identify and flag quality issues, performance problems, and opportunities to reduce power consumption in architecture, microarchitecture, RTL, or circuits.Collaborate with the verification team by reviewing test plans, assisting with writing assertions and coverage monitors, and providing feedback and suggestions for test changes.Debug and identify root causes and solutions for pre-silicon and post-silicon issues encountered in current HBM products and architectures.Engage with customers to support issues with current HBM architectures and find opportunities to innovate on future HBM solutions.How To Qualify:Proficiency in microarchitecture and high-quality RTL development with the ability to write and test code in System Verilog.Experience with automating IP integration using standards such as IP-XACT and tools such as Coretools, Defacto etc..Experience with using register description languages such as SystemRDL.Experience with SOC integration methods such as DFT/MBIST, CDC, and static LP checks.Experience dealing with clock domain crossings (CDC).Experience with SOC interconnects and bus standards like AMBA AXI, ACE, APB, AHB, etc.Ability to write assertions using SVA.Understanding of how to optimize a design for performance and low power consumption and how to use UPF.Good knowledge of static timing analysis, synthesis design constraints, and how to close timing by using logic techniques, false path constraints, and multi-cycle path constraints.Understanding of design for testability concepts such as MBIST and scan and how to write RTL for testability.Proven track record of innovation and problem-solving in high-performance and/or low power SOC development.7+ years of relevant job/skill-related experience.Experience delivering highly technical solutions.What Sets You Apart:BSEE or higher.Proven track record of innovation and problem-solving in high-performance and/or low power SOC development.Familiarity with DRAM operation and JEDEC specifications, preferably with the HBM product family.Familiarity with scripting languages such as Python.Experience with working on one or more of the following IPs: UCIE, Memory Controller, NOCs.Experience with NOC generation tools.Experience in any of the following focus areas: memory array architectures, on-die and off-die high-speed signaling, PHY & interface development, power delivery network planning and optimization, power consumption reduction, CMOS requirements identification, packaging technologies, and thermal modeling.Good verbal and written communication skills with the ability to efficiently synthesize and convey sophisticated technical concepts to other partners and leadership.A self-motivated, hard-working team player who enjoys working with diverse abilities and backgrounds.An innovative approach that is open to improving upon any of our processes or products.As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.To learn about your right to work click here.To learn more about Micron, please visit micron.com/careersFor US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s People Organization at hrsupport_na@micron.com or 1-800-336-8918 (select option #3)Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.
Job DescriptionOur vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.Our Opportunity Summary:For more than 43 years, Micron Technology, Inc. has redefined innovation with the world’s most advanced memory and semiconductor technologies. We’re an international team of visionaries and scientists, developing groundbreaking technologies that are transforming how the world uses information to enrich life.As an HBM SOC Pre-Silicon Verification Engineer, you will be responsible for the design & development of next-generation HBM DRAM products. You will be part of a highly multi-functional team of technical domain experts collaborating closely with a distributed team of Design Engineering, Product Engineering, Process Development, Package Engineering & Business Units to implement a common goal of ensuring our future HBM roadmap is successful. You will apply your deep understanding of SOC Architecture, RTL Logic Design, IP Integration, high-speed interface design, high-performance computing architectures, and 2.5D & 3D package integration to understand and analyze bottlenecks and propose innovative architectures to target best-in-class performance, power, cost, reliability and quality for Micron’s HBM product portfolio.In HBM HIG (High Bandwidth Memory – Heterogenous Integration Group), we innovate and integrate end-to-end groundbreaking front-end and backend processes with groundbreaking design, simulation, testing, debugging and qualification techniques to develop the lowest power per bit solutions to improve customer experience in the field of ML (Machine Learning) and AI (Artificial Intelligence). The success of a sophisticated product such as HBM relies vastly on vertical integration and the various engineering working in unison. To provide greater detail, our HBM technology pertains to stacking numbers of DRAM chips along with a logic chip within one package through an assembly technology called TSV (Through Silicon Via). This greatly increases the memory density in a package, while allowing very high-speed signal transmission. Furthermore, "high bandwidth"; is an outstanding memory design area where custom gate-level design and RTL style logic design are blended into the same product, and most of the DDR or LPDDR design is based on the gate-level design only while the Logic chip can use a full ASIC flow. Lastly, verification and testing (validation) of HBM is the most challenging due to the total size of the design and complexity of the functions, and in addition to craft, many innovations are needed for verification and validation of the HBM product, thereby making it uniquely exciting.What’s Encouraged Daily:Develop test plans at IP/Subsystem/SOC Level.Review architectural specifications to ensure high quality.Be efficient and productive in executing project deliverables, whether developing verification environments, creating test plans, writing and running tests, debugging failures, coding assertions and cover points, and modifying tests to hit target coverage.Work with IP suppliers to ensure that proper validation collateral is provided.Work with customers to understand their validation requirements and provide validation collateral as needed.Be proactive in identifying and flagging quality issues, performance problems, and opportunities to reduce power consumption.Debug and identify root causes and solutions for pre-silicon and post-silicon issues encountered in current HBM products and architectures.Engage with customers to support issues with current HBM architectures and find opportunities to innovate on future HBM solutions.How To Qualify:Ability to develop validation environments using System Verilog and UVM.Ability to write tests using UVM.Experience with writing assertions and coverage monitors using SVA.Knowledge of Register Description Languages such as SystemRDL and UVM RAL.Solid understanding of computer architecture concepts.Experience with SOC interconnects and bus standards like AMBA AXI, ACE, APB, AHB, etc.Experience with scripting languages such as Python.4+ years of relevant job/skill-related experience.Experience delivering highly technical solutions.What Sets You Apart:BSEE or greater.Proven track record of innovation and problem-solving in building verification environments and/or validating complex SOCs.Experience working with Synopsys and/or Cadence validation IPs.Familiarity with DRAM operation and JEDEC specifications, preferably with the HBM product family.Experience working on gate-level simulation (GLS).Experience with coding in C++.Experience with modeling using SystemC.Experience writing and debugging tests to quantify and improve system performance and/or reduce power consumption.Experience in any of the following IPs: UCIE, memory controller, NOCs, MBIST, ATPG scan controllers.Good verbal and written communication skills with the ability to efficiently synthesize and convey sophisticated technical concepts to other partners and leadership.A self-motivated, hard-working team player who enjoys working with diverse abilities and backgrounds.Having an innovative approach that is open to improving upon any of our processes or products.As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.To learn about your right to work click here.To learn more about Micron, please visit micron.com/careersFor US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s People Organization at hrsupport_na@micron.com or 1-800-336-8918 (select option #3)Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.
Job DescriptionOur vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.Job Description:Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.For more than 45 years, Micron Technology, Inc. has redefined innovation with the world’s most advanced memory and semiconductor technologies. We’re an international team of visionaries and scientists, developing groundbreaking technologies that are transforming how the world uses information to enrich life.You will be a verification architect working on architecting and developing modular, scalable verification solutions for the next generation HBM DRAM products spread across different customer platforms. You will be part of a highly cross-functional team of technical subject matter experts collaborating closely with a global team of Design Engineering, Product Engineering & Business Units and external customer teams to execute to a common goal of ensuring our future HBM roadmap is successful. You will apply your deep understanding of testbench architecture, custom design verification methodologies, SoC verification methodologies, and 2.5D & 3D package integration to understand and analyze bottlenecks and propose innovative architectures and solutions to target best in class scalability, quality, testbench performance and verification cycle time.Responsibilities will include, but are not limited toDeliver high-quality, on-time, verification and architecture deliverablesParticipate in co-verification of overall system through direct customer interactionsDevelop turnkey verification solutions for future designs based on lookahead information available from customers and the rest of the architecture teamBuild verification methodology improvements and GenAI applications with a roadmap aligned to the HBM design cyclesContributing to cross group communication to work towards standardization and group successAttract, recruit, train, engage and retain top talent to build a world-class design architecture teamChallenge the team to set and achieve stretch objectives while focusing on continuous improvement in schedules, quality and capabilityBuild team culture of hard work, innovation, and strong global collaboration with a focus on Micron’s ValuesDebug and identify root causes and solutions for pre-silicon and post-silicon issues encountered in current HBM products and architecturesEngage with Customers to support issues with current HBM architectures and identify opportunities to innovate on future HBM solutionsPathfinding to explore new architectures for future HBM products and make recommendations after performing highly technical feasibility analysesSuccessful candidates for this position will haveExperience in delivering on highly technical verification efforts/solutionsUnderstand the complete scope of pre-silicon verification for products from design kick-off to tapeoutExcellent problem-solving and analytical skillsFamiliarity with DRAM operation and JEDEC specifications, preferably with HBM product familyKnowledge and experience in digital (Verilog) or analog (FastSpice & Hspice) modeling and simulationsTechnical expertise in one or more areas – testbench architecture, custom design / schematic based verification, SoC integration/verification, VIP developmentGood verbal and written communication skills with the ability to effectively synthesize and convey complex technical concepts to other partners and leadershipStrong track record of innovation and problem-solving in verification solutionsBonus - Prior experience with CMOS circuit designBonus - Good understanding of semiconductor device physicsBonus - Good understanding of Memory subsystem operation in high-performance computing applicationsBonus – Prior experience with RTL Design flow, in DRAM process or Foundry processBonus - Prior experience with DRAM product bring-up and debugBonus - Prior experience with package technologies (TSV, hybrid bonding, interposers, etc)Required Qualification:BSEE or greater4+ years of relevant Engineering experienceAs a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.To learn about your right to work click here.To learn more about Micron, please visit micron.com/careersFor US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s People Organization at hrsupport_na@micron.com or 1-800-336-8918 (select option #3)Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.
Job DescriptionOur vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.About our Team:
The DRAM and Emerging Memory Quality and Reliability Assurance (DEMORA) team is dedicated to ensuring the quality and reliability of Micron's high-performance memory products, focusing on memory technologies like High Bandwidth Memory (HBM) and GDDR. We collaborate closely with engineering, manufacturing, and customer teams to address failure analysis and drive continuous improvements in product performance.
Position Overview:
As a DRAM and Emerging Memory Quality and Reliability Assurance (DEMORA) Return Material Authorization (RMA) Engineer, you will lead the Failure Analysis (FA) process for customer-returned products, with a focus on electrical and physical characterization. This role requires you to drive testing strategies, collaborate with cross-functional teams, and provide actionable insights to improve product quality and reliability.
Responsibilities: Perform and manage electrical characterization testing activities on HBM products returned to Micron to identify root causes. Provide ad hoc support for GDDR parts as needed. Collaborate with HBM fabrication, assembly, product, and test engineering teams to optimize testing strategies and processes for customer defects. Develop and provide technical analysis reports to customers, identifying analysis observations, test coverage, and process improvements. Optimize HBM RMA testing strategies to enhance the timeliness and effectiveness of the characterization process.
Minimum Qualifications: Strong background in CMOS circuits, circuit analysis, and electrical characterization techniques. Good understanding of solid-state device physics, semiconductor processing, and characterization techniques. Excellent written and verbal communication skills, with the ability to interact effectively with cross-functional teams. Ability to work both independently and collaboratively in a multi-discipline team environment.
Preferred Qualifications: Experience with bench EFA (Electrical Failure Analysis) or ATE testing. Strong problem-solving and analytical skills, with a proven ability to address complex technical challenges. Programming skills in Python, Perl, or other languages on Unix/Linux, particularly for data analysis and production data handling. Industry experience in characterizing memory or CMOS products using electrical characterization techniques. BS/MS in Electrical or Computer Engineering, or 3+ years of hands-on test engineering experience.As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.To learn about your right to work click here.To learn more about Micron, please visit micron.com/careersFor US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s People Organization at hrsupport_na@micron.com or 1-800-336-8918 (select option #3)Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.
