About Etched
Etched is building the world’s first AI inference system purpose-built for transformers - delivering over 10x higher performance and dramatically lower cost and latency than a B200. With Etched ASICs, you can build products that would be impossible with GPUs, like real-time video generation models and extremely deep & parallel chain-of-thought reasoning agents. Backed by hundreds of millions from top-tier investors and staffed by leading engineers, Etched is redefining the infrastructure layer for the fastest growing industry in history.
Job Summary
As a Signal & Power Integrity Engineer you will be responsible for the electrical performance of our AI accelerator platform across silicon, package, and board. The ideal candidate will have extensive experience with high-power package and board designs, robust power delivery networks, and high-speed signaling solutions in advanced packaging. You will work closely with silicon, package, platform, and system teams to co-design world-class platforms with OSAT and ODM partners. Intense focus on pushing what is possible in power delivery and high-speed signaling for transformer-purposed silicon.
Key Responsibilities
SI/PI analysis of designs and optimization within 2D/2.5D/3D packages
Close interaction with Package Layout Designers, ASIC PD and IP teams as well as Board Schematic/Layout/SI/PI teams to optimize the best electrical performance
Drive SI requirements into interposer/substrate layout (high-speed routing: 112G/224G) from preliminary design through tape-out.
Drive PDN design and decoupling strategy across substrate and interposer, owning DC IR drop, dynamic IR drop, and impedance targets across all rails.
Own ball map / C4 / BGA pin assignment from soft freeze through final freeze in partnership with package layout, ASIC PD, and board layout teams.
Support board-level SI/PI and rack-level scale-up topology studies, including rack test vehicle design and cable characterization.
Participating in cross-functional meetings and design reviews.
You may be a good fit if you have (Must-have qualifications)
Bachelor's or Master's degree in Electrical Engineering, Computer Engineering, or a related field with a strong understanding of signal integrity and power integrity concepts and fundamentals.
8+ years of SI/PI experience on high-performance ASIC, processor, or accelerator platforms.
Proven experience defining and closing PDN for high-power silicon, including substrate and PCB plane design, decap strategy, and dynamic IR/EM analysis.
Experience with developing systems with high-speed interfaces like HBM, SerDes and D2D interfaces.
Hands-on expertise with one or more of: ANSYS HFSS / SIwave, Cadence Sigrity (PowerSI / PowerDC), Keysight ADS.
Experience with CoWoS or equivalent advanced packaging materials and technologies including interposer SI/PI implications, C4 bump planning, and substrate stack-up trade-offs.
Track record of designing and correlating SI/PI test vehicles against silicon measurement during bring-up and lab characterization.
Strong analytical and communication skills, comfortable presenting risk, sign-off status, and trade-offs to cross-functional leadership.
Deeply creative and able to think from first principles.
Strong candidates may also have experience with (Nice-to-have qualifications)
Familiarity with full RTL-to-GDSII context and how PD decisions interact with package and board PDN.
Experience with multi-die, 2.5D, or 3D packaging signoff, including chip-package-system (CPS) co-design.
Project management experience coordinating across internal teams, OSAT partners, and PCB ODMs.
Familiarity with transformer models, accelerator architectures, or HPC system design.
Startup experience or comfort working in fast-paced environments.
Benefits
Medical, dental, and vision packages with generous premium coverage
$500 per month credit for waiving medical benefits
Housing subsidy of $2k per month for those living within walking distance of the office
Relocation support for those moving to San Jose (Santana Row)
Various wellness benefits covering fitness, mental health, and more
Daily lunch and dinner in our office
Unlimited compute budget subject to ROI justification
How we’re different
Etched believes in the Bitter Lesson. We think most of the progress in the AI field has come from using more FLOPs to train and run models, and the best way to get more FLOPs is to build model-specific hardware. Larger and larger training runs encourage companies to consolidate around fewer model architectures, which creates a market for single-model ASICs.
We are a fully in-person team in San Jose and Taipei, and greatly value engineering skills. We do not have boundaries between engineering and research, and we expect all of our technical staff to contribute to both as needed.
Compensation Range: $150K - $275K
Read LessAbout Etched
Etched is building the world’s first AI inference system purpose-built for transformers - delivering over 10x higher performance and dramatically lower cost and latency than a B200. With Etched ASICs, you can build products that would be impossible with GPUs, like real-time video generation models and extremely deep & parallel chain-of-thought reasoning agents. Backed by hundreds of millions from top-tier investors and staffed by leading engineers, Etched is redefining the infrastructure layer for the fastest growing industry in history.
Job Summary
We are seeking a talented Thermo-Mechanical, CFD Simulation Engineering Intern focused on Chip-on-Wafer-on-Substrate (CoWoS) package development to join our Advanced IC Packaging Team in Fall '26, Spring '27, or Summer '27. You'll use tools like ANSYS Mechanical APDL and ANSYS FLUENT to perform critical thermo-mechanical/CFD analysis and contribute to next-generation high-performance computing systems.
Key responsibilities
Develop FEA models for CoWoS-based IC packages using ANSYS Mechanical APDL
Perform thermo-mechanical stress/strain analysis and thermal cycling simulations
Analyze package warpage, solder joint reliability, and interconnect stress
Develop CFD models using ANSYS FLUENT for solder reflow modeling
Collaborate with design engineering teams on package development
You may be a good fit if you have
Education & Experience
Pursuing a degree in Mechanical Engineering or related field
Academic or project experience with FEA/CFD tools and analysis
Technical Skills
Proficiency in SOLIDWORKS/NX, ANSYS Mechanical APDL and ANSYS FLUENT
Understanding of semiconductor packaging materials and processes
Strong grasp on non-linear properties of materials (elastic-plastic, viscoelastic)
Familiarity with CoWoS-S/L/R, TSVs, or 2.5D/3D integration concepts
Basic programming/scripting skills (APDL, Python, MATLAB)
Strong candidates may have some experience with
Knowledge of solder joint reliability and failure analysis
Familiarity with JEDEC standards and reliability testing
Previous internship in semiconductor industry
We encourage you to apply even if you do not believe you meet every qualification.
Program details
12-week paid internship
Generous housing support for those relocating
Daily lunch and dinner in our office
Based at our office in San Jose, CA
Direct mentorship from industry leaders and world-class engineers
Opportunity to work on one of the most important problems of our time
For any questions, contact internships@etched.com.
How we’re different
Etched believes in the Bitter Lesson. We think most of the progress in the AI field has come from using more FLOPs to train and run models, and the best way to get more FLOPs is to build model-specific hardware. Larger and larger training runs encourage companies to consolidate around fewer model architectures, which creates a market for single-model ASICs.
We are a fully in-person team in West San Jose, and greatly value engineering skills. We do not have boundaries between engineering and research, and we expect all of our technical staff to contribute to both as needed.
Read LessAbout Etched
Etched is building the world's first AI inference system purpose-built for transformers — delivering over 10x higher performance and dramatically lower cost and latency than a B200. With Etched ASICs, you can build products that would be impossible with GPUs, like real-time video generation models and extremely deep & parallel chain-of-thought reasoning agents. Backed by hundreds of millions from top-tier investors and staffed by leading engineers, Etched is redefining the infrastructure layer for the fastest growing industry in history.
Job Summary
Etched is looking for a Lab Operations Manager to own the day-to-day operational backbone of our Platforms Validation lab. This is a hands-on operational role reporting to the Head of Lab Operations, responsible for everything between hardware arriving at our dock and engineers running it in a rack — board intake and serialization, request tracking and prioritization, rework coordination, physical lab infrastructure, equipment commissioning, inventory management, safety compliance, and end-to-end workflow execution. You will work alongside Lead Technicians and coordinate with Test Operators, Engineering Technicians, Rework Technicians, and Mechanical Technicians, and will interface closely with the Head of Lab Operations and the Head of Platform Validation Engineering to ensure lab operations are aligned with engineering priorities and program schedules.
The ideal candidate has a strong background in lab or infrastructure operations and the operational rigor to build and maintain the systems that keep a fast-moving hardware lab running — including accurate inventory tracking, intake and triage of engineering requests, equipment lifecycle management, and the technical depth to engage meaningfully with hardware validation workflows such as reading schematics, understanding bring-up sequences, and coordinating PCB rework activities.
Key Responsibilities
Lab Operations & Board Flow
Own end-to-end board flow: incoming serialization, rework coordination, mechanical assembly, screening, and rack integration.
Serve as the central point of contact for hardware resource allocation, developmental server assignments, and board status tracking.
Maintain a live status tracker for all boards in-flight across lab stages; communicate status and risks to engineering and program leadership.
Drive rework prioritization in coordination with validation engineers; coordinate rework technicians and interface with rework partners.
Request Intake & Tracking
Own the intake process for all lab operations requests from engineering — triage, prioritize, and assign work to ensure nothing falls through the cracks.
Maintain accurate, real-time tracking of all active requests, board statuses, and task queues using project management tools (Jira, Wrike, or similar).
Provide regular status updates and reporting to the Head of Lab Operations and engineering stakeholders.
Identify recurring request patterns and propose process improvements to reduce turnaround time.
Physical Lab Infrastructure & Safety
Receive, commission, and stand up incoming lab equipment — instruments, servers, benches, fixtures, and rack systems.
Maintain equipment health, calibration records, and maintenance schedules across the lab.
Own equipment ordering, shipping, and receiving; negotiate with suppliers and manage vendor relationships.
Collaborate with site services and facilities to maintain and improve physical lab infrastructure to support system deployments.
Coordinate rack build scheduling; prepare lab areas to streamline installation and deployment.
Own lab safety programs: enforce ESD protocols, maintain safety documentation, conduct regular audits, and ensure compliance with environmental health and safety (EH&S) standards.
Manage chemical, material, and consumable inventories; ensure proper storage, labeling, and disposal procedures.
Inventory Management
Build and maintain a comprehensive inventory system for all lab assets — boards, equipment, fixtures, cables, consumables, and spares.
Track asset locations, conditions, and lifecycle status; flag end-of-life or low-stock items proactively.
Manage procurement workflows for lab supplies and equipment; maintain relationships with suppliers and ensure timely fulfillment.
Conduct periodic physical inventory audits and reconcile against system records.
Process & Cross-Functional Coordination
Define, document, and continuously improve lab operational processes from receipt through system integration.
Identify and escalate workflow bottlenecks with structured mitigation proposals.
Work closely with validation engineers, electrical engineers, firmware engineers, and program managers to maintain clear understanding of lab priorities and design requirements.
Support system validation test activities where relevant — including understanding schematics, coordinating PCB rework, and supporting measurement setups.
Must-Have Qualifications
Bachelor's degree in a technical field, or equivalent hands-on experience in a lab or hardware operations environment.
5+ years of experience in lab operations, test operations, hardware infrastructure, or a related field; including at least 1–2 years in a coordination or lead role.
Demonstrated ability to build and maintain operational tracking systems — inventory databases, request queues, status dashboards — and keep them accurate under pressure.
Technical depth sufficient to engage with hardware validation workflows — ability to read schematics, understand PCB-level debug concepts, and coordinate rework activities.
Strong cross-functional communication skills; comfortable interfacing with engineers, managers, vendors, and site services.
Experience owning physical infrastructure: equipment ordering, commissioning, calibration, and facilities coordination.
Working knowledge of lab safety practices, including ESD handling, chemical storage, and general EH&S compliance.
Proficiency with project tracking tools (Jira, spreadsheets, or similar) for status and workflow management.
Ability to work independently, manage ambiguity, and operate with high ownership in a fast-moving environment.
Nice-to-Have Qualifications
Background in semiconductor, AI hardware, or data center infrastructure.
Experience at a hardware startup where operational processes were built from scratch.
Familiarity with bring-up, validation, or screening workflows for complex PCBs or ASICs.
Experience managing external vendor or contract relationships (rework houses, mechanical assembly partners, facilities contractors).
Proficiency with asset management or inventory tracking software.
Proficiency with Figma, Google Drive, or similar tools for lab documentation and site planning.
Experience with high-tech construction or lab buildout project management.
Benefits
Medical, dental, and vision packages with generous premium coverage
$500 per month credit for waiving medical benefits
Housing subsidy of $2k per month for those living within walking distance of the office
Relocation support for those moving to San Jose (Santana Row)
Various wellness benefits covering fitness, mental health, and more
Daily lunch and dinner in our office
Unlimited compute budget subject to ROI justification
How we’re different
Etched believes in the Bitter Lesson. We think most of the progress in the AI field has come from using more FLOPs to train and run models, and the best way to get more FLOPs is to build model-specific hardware. Larger and larger training runs encourage companies to consolidate around fewer model architectures, which creates a market for single-model ASICs.
We are a fully in-person team in San Jose and Taipei, and greatly value engineering skills. We do not have boundaries between engineering and research, and we expect all of our technical staff to contribute to both as needed.
Read LessAbout Etched
Etched is building the world’s first AI inference system purpose-built for transformers - delivering over 10x higher performance and dramatically lower cost and latency than a B200. With Etched ASICs, you can build products that would be impossible with GPUs, like real-time video generation models and extremely deep & parallel chain-of-thought reasoning agents. Backed by hundreds of millions from top-tier investors and staffed by leading engineers, Etched is redefining the infrastructure layer for the fastest growing industry in history.
Job Summary
We are seeking a hands-on manufacturing leader to drive Design for Manufacturing (DFM), supplier execution, and design validation across complex mechanical components. This role partners closely with suppliers to develop, qualify, and scale robust manufacturing processes across CNC machining, die casting, sheet metal, stamping, and sub-assemblies. The ideal candidate will lead tooling, automation, inspection strategy, and DOE-driven process development while ensuring supplier readiness for builds and production ramp. By owning qualification builds (EVT/DVT/PVT), driving root cause resolution, and leading continuous improvement initiatives, this role ensures high-quality, cost-effective, and scalable production aligned with program milestones.
Key Responsibilities
Review supplier tool designs, fabrication process flows, equipment selection, DFM strategies, and DOE proposals (CNC machining, die casting, sheet metal, stamping, sub-assemblies).
Develop and qualify manufacturing processes for mechanical components across key fabrication methods.
Drive fixture, tooling, and automation development in partnership with suppliers.
Establish inspection strategies and metrology requirements for tight-tolerance components.
Lead continuous improvement initiatives to improve cycle time, yield, cost, and overall process robustness.
Partner with supplier engineering teams to define process development plans, secure resources, and align schedules with program milestones.
Assess supplier readiness for build events and production ramp; proactively identify risks and implement mitigation plans.
Provide onsite technical leadership during line bring-up, pilot builds, and ramp readiness activities.
Ensure supplier process capability meets defined quality, cost, and delivery targets for mass production.
Plan, propose, and lead structured experiments (DOE) to generate data that drives design, development, and supply chain decisions.
Own process qualification builds (EVT/DVT/PVT) and drive corrective actions to close yield and quality gaps.
Perform structured root cause analysis (8D, DMAIC, fishbone, DOE) and implement sustainable corrective actions.
Translate build learnings into actionable design and process improvements to strengthen product validation and production readiness.
You may be a good fit if you have
Experience supporting L6–L11 data center compute platforms, high-performance computing (HPC) systems, and complex industrial products.
Familiarity with high-density server packaging constraints, including airflow management, serviceability, blind-mate connector systems, and rack-level integration requirements
Demonstrated ability to drive cost reduction without compromising quality or performance.
Strong understanding of server architecture constraints including SI/PI (signal and power integrity), thermal-mechanical reliability, and high-speed interface requirements.
Benefits
Medical, dental, and vision packages with generous premium coverage
$500 per month credit for waiving medical benefits
Housing subsidy of $2k per month for those living within walking distance of the office
Relocation support for those moving to San Jose (Santana Row)
Various wellness benefits covering fitness, mental health, and more
Daily lunch + dinner in our office
Unlimited compute budget subject to ROI justification
How we’re different
Etched believes in the Bitter Lesson. We think most of the progress in the AI field has come from using more FLOPs to train and run models, and the best way to get more FLOPs is to build model-specific hardware. Larger and larger training runs encourage companies to consolidate around fewer model architectures, which creates a market for single-model ASICs.
We are a fully in-person team in San Jose (Santana Row), and greatly value engineering skills. We do not have boundaries between engineering and research, and we expect all of our technical staff to contribute to both as needed.
Compensation Range: $150K - $220K
Read LessAbout Etched
Etched is building the world’s first AI inference system purpose-built for transformers - delivering over 10x higher performance and dramatically lower cost and latency than a B200. With Etched ASICs, you can build products that would be impossible with GPUs, like real-time video generation models and extremely deep & parallel chain-of-thought reasoning agents. Backed by hundreds of millions from top-tier investors and staffed by leading engineers, Etched is redefining the infrastructure layer for the fastest growing industry in history.
Job Summary
We are seeking a highly experienced Senior Thermal Engineer, Liquid Cooling Systems to join our team and lead our efforts in optimizing thermal management for high-performance systems. As a Senior Thermal Engineer, Liquid Cooling Systems at Etched, you will play a crucial role in developing and implementing advanced thermal management solutions for our high-performance data center products. Your expertise in water cooling, thermal simulations, and cooling system design will be essential in ensuring optimal thermal performance and reliability. You will work with various water cooling components, including internal manifolds, quick disconnects, CDU (Coolant Distribution Units), heat exchangers, and advanced thermal interface materials.
Key responsibilities
Lead the design and optimization of thermal management systems for high-performance data center products, focusing on water cooling solutions and advanced cooling concepts.
Develop and implement water cooling solutions, including internal manifolds, quick disconnects, CDUs (Coolant Distribution Units), and heat exchangers. Ensure effective cooling and thermal management for high-power processors and other critical components.
Design and manage direct-to-processor water cooling systems to efficiently dissipate heat and maintain optimal operating temperatures.
Conduct detailed thermal simulations to predict and analyze thermal performance. Use simulation results to guide the design and optimization of cooling systems.
Evaluate and select thermal interface materials (TIMs) for various heat sinks and cooling solutions. Optimize TIM performance to enhance thermal conductivity and heat dissipation.
Explore and implement advanced thermal cooling concepts, including phase change cooling, liquid cooling, and other cutting-edge technologies.
Oversee the testing and validation of thermal management systems to ensure they meet performance, reliability, and efficiency standards. Address any issues related to thermal performance and provide solutions.
Create and maintain comprehensive documentation for thermal management designs, including design specifications, simulation results, and testing reports. Report on performance and any issues identified during testing.
Work closely with cross-functional teams, including mechanical engineers, electrical systems engineers, and vendors, to ensure seamless integration and operation of thermal management solutions.
You maybe a good fit if you have
A Bachelor’s degree in Mechanical Engineering or Thermal Engineering, or a related field. Advanced degrees or certifications in thermal management or related areas are highly desirable.
A Minimum of 10 years of experience in thermal engineering with a strong focus on water cooling systems and advanced thermal management solutions. Proven expertise in designing and managing direct-to-processor cooling systems and thermal simulations.
Extensive experience with water cooling systems, including internal manifolds, quick disconnects, CDUs, and heat exchangers
Expertise in direct-to-processor cooling solutions and thermal management for high-power components
Proficiency in thermal simulation tools and techniques to predict and analyze thermal performance
Knowledge of various thermal interface materials (TIMs) and heat sink designs
Experience with advanced thermal cooling concepts and technologies.
We encourage you to apply even if you do not believe you meet every single qualification.
Benefits
Medical, dental, and vision packages with generous premium coverage
$500 per month credit for waiving medical benefits
Housing subsidy of $2k per month for those living within walking distance of the office
Relocation support for those moving to San Jose (Santana Row)
Various wellness benefits covering fitness, mental health, and more
Daily lunch + dinner in our office
Unlimited compute budget subject to ROI justification
How we’re different
Etched believes in the Bitter Lesson. We think most of the progress in the AI field has come from using more FLOPs to train and run models, and the best way to get more FLOPs is to build model-specific hardware. Larger and larger training runs encourage companies to consolidate around fewer model architectures, which creates a market for single-model ASICs.
We are a fully in-person team in San Jose (Santana Row), and greatly value engineering skills. We do not have boundaries between engineering and research, and we expect all of our technical staff to contribute to both as needed.
Compensation Range: $200K - $250K
Read LessAbout Etched
Etched is building the world’s first AI inference system purpose-built for transformers - delivering over 10x higher performance and dramatically lower cost and latency than a B200. With Etched ASICs, you can build products that would be impossible with GPUs, like real-time video generation models and extremely deep & parallel chain-of-thought reasoning agents. Backed by hundreds of millions from top-tier investors and staffed by leading engineers, Etched is redefining the infrastructure layer for the fastest growing industry in history.
Job Summary
We are seeking an experienced Mechanical Engineer to join our team and help transform complex designs into reliable, high-power data center products. As a Mechanical Engineer at Etched, you will be integral to the development of high-performance data center products, from initial concept through to production. You will collaborate closely with both internal and external design engineers, including JDM (Joint Design Manufacturer) partners. Your expertise in mechanical design, particularly for data center chassis and high-power systems, will ensure our products meet rigorous performance, reliability, and manufacturability standards.
Key Responsibilities
Develop and refine mechanical designs for high-power data center products, ensuring robust performance and reliability. Manage the transition from appearance models to production-ready designs.
Work closely with internal design teams and external partners, including Joint Design Manufacturers (JDMs), to ensure seamless integration of mechanical designs with overall product architecture.
Lead the design of data center chassis and enclosures from concept through production, focusing on meeting high power, cooling efficiency, and ruggedness requirements.
Oversee and manage the development of both soft and hard tooling to support mass production, ensuring that all tooling meets strict quality and consistency specifications.
Ensure that mechanical designs comply with manufacturing requirements, including shock and vibration standards, to guarantee durability and performance in demanding data center environments.
Translate industrial design concepts into manufacturable designs, effectively converting appearance models into production-ready mechanical solutions.
Apply DFM principles to optimize designs for cost-effective manufacturing, assembly, and maintenance, ensuring high efficiency and reduced production costs.
You maybe a good fit if you have
A Bachelor’s degree in Mechanical Engineering or a related field is essential. Advanced degrees or certifications in mechanical design or manufacturing are a plus.
A minimum of 10 years of experience in mechanical engineering with a focus on high-power data center products, including a proven track record in designing and managing chassis and enclosures for data centers, is required.
Strong expertise in mechanical design and engineering principles is necessary, along with hands-on experience in transforming industrial design concepts into production-ready models.
Extensive experience in data center chassis design, with a deep understanding of high-power and cooling requirements, is important.
Proficiency in mechanical CAD software and tools such as SolidWorks, Creo, FX, CATIA, or similar is required.
A deep understanding of tooling processes, including both soft and hard tooling, and their impact on product design and production, is critical.
Familiarity with manufacturing requirements and standards, including shock and vibration testing, is expected to ensure that designs are durable and meet industry expectations.
Excellent problem-solving skills and a keen attention to detail are essential to ensure that every aspect of design work is meticulously considered.
Benefits
Medical, dental, and vision packages with generous premium coverage
$500 per month credit for waiving medical benefits
Housing subsidy of $2k per month for those living within walking distance of the office
Relocation support for those moving to San Jose (Santana Row)
Various wellness benefits covering fitness, mental health, and more
Daily lunch + dinner in our office
Unlimited compute budget subject to ROI justification
How we’re different
Etched believes in the Bitter Lesson. We think most of the progress in the AI field has come from using more FLOPs to train and run models, and the best way to get more FLOPs is to build model-specific hardware. Larger and larger training runs encourage companies to consolidate around fewer model architectures, which creates a market for single-model ASICs.
We are a fully in-person team in San Jose (Santana Row), and greatly value engineering skills. We do not have boundaries between engineering and research, and we expect all of our technical staff to contribute to both as needed.
Compensation Range: $150K - $275K
Read Less